This issue includes articles on the following topics:
Thermal Management of LED Systems
Synthetic Jets: Solution for Active Cooling
Embedded CFD Helps Reduce Number of Thermal Prototypes from Up to 12 to One
EBM-Pabst and DSM Engineering Plastics Collaboration Leads to Innovative Fan in LED Headlamps for Hella
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Low Profile Heat Sinks Cool Hot Components in Constricted Packages Advanced Thermal Solutions, Inc. has introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm. Read More
ECD Announces New Calibration Plan to Reduce Costs and Downtime
An integral part of what makes even the most sophisticated equipment effective is not its design, its software, or even its age; it is its calibration. Over the last year ECD not only pointed out the need to make sure ovens remain accurate throughout production and thermal profiles remain consistent through every run, they also developed products to assure that they do. Read More
Infrared Thermometer with Patented Circle/Dot Laser Sighting and Wireless USB Model OS-DT8855W
The high performance, handheld OS-DT8855W infrared thermometer is a non-contact temperature measurement instrument that features a laser circle/dot sight. The patented laser sighting system defines the target for point and shoot measurement of temperatures from -50°C to 1,370°C and reads surface temperature in less than a second.
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Advanced Thermal Solutions, Inc. has introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm.