space

August 2017

space

space

Feature Article

space
space

Fanless Thermal Solution Design Guide for IoT Applications

Mike Schroeder – Intel Corp IoT Thermal Mechanical Systems Eng.
Jacob Fritsch – Intel Corp IoT Thermal Mechanical Systems Eng.
Erich Ewy – Intel Corp IoT Thermal Mechanical Systems Mgr.

 

The internet of things (IoT) network of interconnected devices is driving an explosion of integrated-electronic components (IC) for embedded applications. Compute and wireless systems and sensors will be deployed at the IoT edge, where environmental considerations have challenging implications for thermal and mechanical design. In order to function reliably in harsh environments with extended operating ambient temperature ranges, electronics housings for IoT solutions that support low-power components with fan-less designs in sealed enclosures will be desirable. This paper is intended to be a practical guide for the thermal designer to quickly size and implement an optimized fanless thermal solution that is feasible for high volume manufacturing.

 

Click Here to Read the Full Article 

space

Sponsored Announcement
space

DuPont Electronic Materials
DuPont Electronic Materials offers a robust portfolio of thermal management materials that provide excellent thermal conductivity, lower thermal resistance, greater heat uniformity and improved thermal stability during continuous use.

To learn more visit: www.dupont.com/industries/electronics.html

space
New Products

Pasternack Debuts Line of RF and Microwave Power Amplifier Accessories

Pasternack has released a new series of RF and microwave power amplifier accessories that includes heat sinks, heat sinks with cooling fans and power control cable assemblies.  Heat sinks are devices that enhance heat dissipation from a hot surface and are ideal for thermal management of power amplifiers in test and measurement applications. - Read More

 

Extremely Soft TIM Delivers Low Thermal Resistance

Sarcon PG25A is one of Fujipoly’s softest and best performing thermal gap filler pads for applications that have delicate components and high compression rates. When it is sandwiched between components of varying shapes and sizes and a nearby heat sink or spreader, this compliant 2.5 W/m°K material exhibits a thermal resistance as low as 0.42°Cin2/W at 14 PSI. - Read More

 

Intertec’s Explosion-Proof Heaters are Certified by INMETRO

The explosion-proof heater range from the outdoor enclosure specialist Intertec has been certified to Brazil’s INMETRO standards. With more than 20 styles of convection and conduction heaters this certification offers process control and instrumentation engineers the largest choice of heaters for hazardous area applications available in Brazil today.  - Read More

Industry News

Engineered Fluids Launches CoolFluids Line of Dielectric Coolants

Designed specifically for single phase, direct immersion cooling of electrical devices, CoolFluids are biodegradable, non-toxic, synthetic dielectric coolants with more than 1,800 times the cooling capacity of air. In addition, CoolFluids have an extremely broad materials compatibility index which allows direct immersion of a wide range of off-the shelf servers and other electronics.  - Read More

 

SPX Cooling Technologies Adds Account Manager Evan Huddy and Technical Specialist Bertoni Marc

SPX Cooling Technologies, Inc. welcomes Account Manager Evan Huddy and Technical Specialist Bertoni Marc to its New York sales office. As part of the New York sales team, Huddy will assist customers in the sale of Marley and Recold evaporative cooling products for all applications.  - Read More

 

National Thermal Engineer Day

In celebration of National Thermal Engineer Day, 6SigmaET have announced a new initiative to raise awareness for jilted thermal engineers. The “Thermal First” campaign, will celebrate the work of thermal engineers and encourage product designers and manufacturers to prioritize thermal management early on in their design processes. - Read More

space

Event Listings

space
space

IoT West 2017 Final Program Announced

The final program for the IoT West Conference have been announced. Already in its 4th year, IoT West will pick up and head to Denver, Colorado for 2017. The conference will consist of two days of technical presentations, an interactive exhibit hall, and pre-conference technical workshops.

 

Click Here to Learn More

 

New for 2017 - The Low Power Networking Summit
IoT West will host a new event covering all manners of low power wide area networking. LPWAN is taking the IoT market by storm, enabling a wide range of IoT and M2M applications with low-bandwidth connectivity. The applications are as endless as the technologies rush to gain dominance in the marketplace. Attend to learn more about: LoRa, zigbee, Bluetooth, RPMA, LoRaWAN, Sigfox, Ultra Narrow Band, LTE-MTC, Narrowband IoT and more. Learn More

space
space
space
space

space
Contact Us

Submit editorial content to Nick Depperschmidt at 720-528-3770 ext 111

For advertising information contact Robert Schaudt at 720-528-3770 ext 125

Webcom Communications • 7355 E. Orchard Road, Suite 100; Greenwood Village, CO 80111
Phone: 800-803-9488 • Fax: 720-528-3771 • www.webcomcommunications.com

© 2017 Webcom Communications Corp.