Mentor Graphics Announces FloEFD Pro 9.3.1 Product for Heat Transfer Simulation
Mentor Graphics Corp’s FloEFD Pro v9.3.1 Concurrent CFD technology is a fully-embedded solution for PTC Pro/Engineer software. Pro/Engineer is the 3D product design standard used by mechanical design engineers, providing integrated parametric 3D CAD/CAM/CAE capabilities to allow users to maximize productivity and develop innovative products.
The Mentor Graphics FloEFD Pro v9.3.1 software works directly with native Pro/Engineer geometry to keep pace with continuous design iterations. Concurrent CFD can reduce simulation time by as much as 65 to 75 percent in comparison to traditional CFD tools.
By using the same geometries and a common user interface (UI), graphics window, and workflow for CAD and analysis, designers can maintain a single set of data across the entire project design process. As a result, the FloEFD Pro 9.3.1 product provides a wide range of physical simulation capabilities for fluid flow, heat and mass transfer, including a special module for electronics cooling applications with extensive property libraries
The FloEFD Pro v9.3.1 product is fully embedded in Pro/ENGINEER Wildfire 3.0, 4.0 and 5.0, for x32 and x64-bit versions including Windows 7.
New temperature control software package from B&R
B&R has introduced its new software-based closed-loop temperature control package that makes commissioning of temperature control loops both faster and more effective. The closed loop control parameters are set automatically, and additional programming is not necessary.
Selected library function blocks in Automation Studio handle closed loop temperature control, and an intuitive user interface allows the user to easily select the temperature range and the temperature sensors used, as well as to define the number of temperature zones required.
The package, which was designed for multi-channel temperature systems with up to 32 independent control loops, provides many auto-tuning possibilities for automatically setting control parameters. Special algorithms ensure that optimized control loop parameters are available for the machine at the push of a button. The compact interface of the controller function blocks also guarantees easy and flexible implementation in the respective automation project. An integrated Visual Components visualization system with trend functionality, data recording and user level administration optimally rounds off the B&R software package. The closed loop temperature control package can be expanded as needed and adapted to the user's individual requirements.
TDK-EPC Offers SMD NTC Thermistors Sample Kit
TDK-EPC is offering design engineers a new sample kit featuring SMD NTC thermistors for temperature measurement and compensation. Samples within the kit span a wide range of SMD NTC thermistors developed specifically for applications in industrial, consumer and household electronics. The product range covers case sizes 0402, 0603 and 0805 with resistances from 4.7 to 470 kΩ and B25/100 values of 3650, 4000, 4480 and 4575 K.
Honeywell Debuts Thermal Management Materials for Portable Computing Devices
Honeywell Electronic Materials has released a new printable thermal management material designed to help manage the tremendous heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.
In typical mobile computing applications, chip temperature rises steeply at start-up and remains high during operations. Honeywell’s PCM45M-SP is designed to meet these specific thermal management requirements, delivering reliable power cycling performance where other thermal materials would typically fail.
PCM45M-SP can withstand more than 1,000 hours at 150°C without degradation and more than 1,000 temperature cycles. The application is not limited to heat sink design, and the material may be applied to a component, heat sink or thermal spreader in any shape built into the printing screen. Additionally, the enhanced stability of this new material minimizes or eliminates the need for pre-mixing, conserving time and resources.
The PCM45M-SP phase change thermal interface consists of a sophisticated thermally conductive material with optimum filler size distribution to achieve maximum packing density compared with conventional phase change materials. PCM45M-SP changes phase at 45°C to ensure maximum surface conformance.
Orion Fans’ 10-inch AC Fans Move Large Amount of Air in Confined Spaces
Orion Fans has experienced extensive growth with its 10-inch AC fans designed specifically to move a large amount of air through confined spaces. The OA254 series AC fans measure 254 mm by 89 mm and feature airflow of 547 CFM on the standard model, and up to 850 CFM on the XC high performance model. Designed for applications involving confined spaces including rack and panel and cabinet enclosures, these fans produce a significant amount of backpressure at the high CFM rating.
Available in 115 VAC and 230 VAC versions, the OA254 series fans feature voltage ranges from 80 to 130 VAC, and 160 to 260 VAC, respectively. Rated power for the standard model is 35 W and up to 75 W on the XC high performance model. Rated speed ranges from 1,650 to 2,700 RPM. The fans feature a dual ball-bearing system, impedance and thermally protected motor, and die cast aluminum frame with a PBT, UL94V-0 plastic impeller.
Maximum static pressure for the OA254 AC fans is 0.39 inches H2O for the standard version and up to 1.14 inches H2O for the high performance model, with noise levels to 69 dB and operating temperature range from -20°C to +80°C. The fans feature a life expectancy of 60,000 hours at 40°C (L10). |
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