eNewsletter

October 2008

In This Issue:
Indium

Product News

  • Rogers Releases New Advanced Circuit Material
  • Omega Engineering Releases 1/16 DIN Temperature Controllers Series CN740
  • RapidWrap Removable Thermal Insulation Covers Now Feature Aerogel Materials
  • REOTEMP Releases Adjustable Angle Bimetal Thermometer
  • JaroThermal’s “Air-Mover” Provides 417 CFM of Chilly Air

Industry News

  • Convergence Technologies Files Lawsuit Regarding Patents in Taiwan
  • Parker Chomerics Announces AS9100B Quality System Registration
  • Degree Controls, Inc. Announces ISO9001 Certification for its Tecate, Mexico Facility

Event Listing

  • Curb Soaring Operations Costs - Learn how at Remote 2008 Conference & Expo

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Chomerics offers a wide range of thermal interface materials that ensure reliability and extend the life of electronic devices. By dissipating the heat, these thermal materials deliver:

  • Lower thermal impedance
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  • Ease of handling and long service life

For maintaining and extending the life of your electronic components, Chomerics has a wide variety of thermal management products, which include gap fillers, pads, tapes, phase change materials, compounds, greases and gels.

Send for your FREE Chomerics Thermal Products Catalog.
Phone: 781-939-4850, Email: chomailbox@parker.com
Website: http://www.chomerics.com/products/thermal.htm

 
PRODUCT NEWS

Rogers Releases New Advanced Circuit Material

Rogers' Advanced Circuit Materials Division (ACMD) has released its new RO2808 high frequency circuit material. With a dielectric constant of 7.6, the ceramic-filled PTFE material offers the stability and high frequency performance of LTCC. It features low loss tangent of 0.002 or less and can be supplied as 1-mil thick boards to support low profile designs. RO2808 laminate features high moisture resistance, high reliability and excellent high frequency performance.

Rogers ACMD will also offers other chip packaging materials including RO4000 laminates and prepregs, ULTRALAM 3000 laminates and bondply, and R/flex 1500 adhesive film.

Rogers' Thermal Management Solutions Division provides HEATWAVE metal matrix composite (MMC) material for overcoming difficult thermal management challenges through effective and efficient dissipation of excess heat. Also on display will be the COOLSPAN thermal interface materials (TIMs) and electrically and thermally conductive adhesives (ETCA).

HEATWAVE MMC is an aluminum silicon carbide (AISiC) composite material that is ideal for thermal base plates and heat spreaders. Available in a wide range of thermal conductivities, it features excellent specific stiffness, tightly controlled coefficient of thermal expansion (CTE), and has considerably lower density than other thermal management materials.

COOLSPAN TIMs are non-silicone thermal conductive greases that help dissipate excess circuit and component heat efficiently. These greases feature excellent thermal stability, reliable high temperature performance, high thermal conductivity, and superior demateability properties to silicone products. They can be used in both TIM-1 and TIM-2 applications, and multiple dispensing options are available. 

COOLSPAN ETCA is a thermally and electrically conductive unsupported silver-filled B-staged epoxy adhesive film. This material is targeted at microwave circuit and heatsink applications where an electrical ground path is desired. Other applications include die attach, printed circuit board fabrication and advanced material composites.


Omega Engineering Releases 1/16 DIN Temperature Controllers Series CN740

The CN740 offers accurate temperature measurement and control in a 1/16 DIN package. This product accepts a variety of thermocouple and RTD inputs, and process value and set-point value can be viewed simultaneously on the large dual LED display.

Auto-tuning, engineering units (°F or °C), and alarm status are also indicated on the faceplate. This CE compliant product offers single output control, either simple on/off or full PID, and two alarm outputs. This product is suitable for water, chemical, plastics, automotive and food processing industries. Free software download is available. Price starts at $88


RapidWrap Removable Thermal Insulation Covers Now Feature Aerogel Materials

LIT Industries, Inc., a subsidiary of Pacor, Inc., has released aerogel insulation material as a filler for their RapidWrap removable thermal insulation covers. These insulation materials are made from nanoporous aerogels that provide characteristics different from traditional materials. Aerogels are available for service temperatures from -460°F (-273°C) to 1,200°F (649°C). They provide two to eight times the insulation value for the same thickness compared to traditional materials. Aerogel RapidWrap covers offer a thin profile that will allow the use of removable covers in tight spaces that previously would have gone unprotected. Aerogels are also hydrophobic, providing outstanding resistance to moisture. They also provide excellent resistance to flame spread and smoke emission.

RapidWrap covers are specifically designed for easy installation, removal and reinstallation. Featuring a durable outer layer and various closure systems, RapidWrap covers have proven highly durable in harsh environments. RapidWrap covers are fabricated using field verified dimensions that are translated into CAD generated drawings. Covers can be designed and fabricated for most any conceivable shape or size. The ease with which the covers can be removed and reinstalled eliminates the need to reinsulate for routine maintenance or when repairing equipment problems.


REOTEMP Releases Adjustable Angle Bimetal Thermometer

REOTEMP’s adjustable angle bimetal thermometer allows for easy temperature monitoring from virtually any position with a complete 180° dial adjustability (360° case rotation).  This rugged adjustable angle thermometer is well-suited for most industrial applications.

Reotemp’s adjustable angle thermometer has a 1 percent full-scale accuracy and is silicone fillable to protect against process vibration. This all stainless steel thermometer is hermetically sealed (ASME B40.3) and has a standard external reset. Reotemp offers a wide variety of standard temperature ranges as well as custom dials and logos.  Choose from a wide variety of options such as a pointed stem, tempered glass, min./max. pointer, certificates of calibration and certificates of conformance. Dial sizes include 3-inch, 4-inch or 5-inch and stem lengths are provided from 2.5-inch to 80-inch. Available connections are 0.5-inch NPT (standard), 0.75-inch NPT adapter, or 0.5 NPT swivel union. 


JaroThermal’s “Air-Mover” Provides 417 CFM of Chilly Air

The new “Air-Mover” series features a unique, high-performance impeller design. This new 172 mm by 150 mm by 51 mm brushless fan delivers 417 CFM (5,300 rpm) of high-flowing air.

In addition to a static pressure of 1.690” of H2O, the life expectancy of the "AD17248UB515100" provides 70,000 hours of long life. It includes a flexible operating voltage of 24 to 56 VDC. This new fan is well-suited for HVAC, server, rack mount or any other ultra-high output application. Options include on-board PWM control, alarm output, tachometer output, thermistor control, IP55 protection and your choice of connector pre-applied.

INDUSTRY NEWS

Convergence Technologies Files Lawsuit Regarding Patents in Taiwan

Convergence Technologies Limited, provider of electronics cooling solutions, filed a lawsuit in the Taiwan Intellectual Property Court against Taiwan Microloops Corp. on Sept. 9, 2008.   

The lawsuit alleges that at least one Microloops’ product for the graphic-card industry uses technologies that infringe on two Convergence Technologies patents in Taiwan.  Investigations are on-going to determine the extent of the infringement in other countries and on other products in the telecom, server and bladeserver markets. It is alleged that Microloops infringed on the Multiwick and Boiling-enhanced Multiwick features that enable effective vapor chamber operations. Vapor chamber is a relatively new cooling technology that has the potential of making an impact on a heat-prone electronic industry. 

Convergence Technologies is seeking injunctive relief barring the infringement, contributory infringement, and inducement to infringe the Convergence patents, as well as monetary damages.  The Multiwick patent has been granted in the US, Taiwan, China and Hong Kong and is pending in several other countries, while the Boiling-Enhanced Multiwick patent has been issued in Taiwan while pending globally.

According to Dr. Steven Lee Founder and CEO of Convergence Technologies, “The Multiwick technology is centered on the premise that the condensate flow in a vapor chamber must increase as it coalesces from the larger condensing surface toward the smaller evaporation surface. This technology and the derivative Boiling-Enhanced Multiwick technology were discovered during many years of hardwork, and we will do what is necessary to defend them.  It is unfortunate that communications with Microloops have not yielded any meaning results.”


Parker Chomerics Announces AS9100B Quality System Registration

Parker Hannifin Corp., company focused on motion and control technologies, announced that its Chomerics Division has achieved AS9100B registration for EMI/RFI and thermal management products manufactured in Woburn, Mass.; Hudson, N.H.; and Jalisco (Guadalajara), Mexico. AS9100B is an internationally recognized quality system standard strongly adhered to by major global aerospace manufacturers.


Degree Controls, Inc. Announces ISO9001 Certification for its Tecate, Mexico Facility

Degree Controls, Inc. (DegreeC) has been awarded ISO9001:2000 certification for its manufacturing facility in Tecate, MX. With this approved facility DegreeC now has certified quality manufacturing operations in both the US and Mexico.

DegreeC has design centers in the US and India and through a robust NPI model offers clients a manufacturing strategy to meet their ever-changing needs. DegreeC has developed hundreds of thermal control assemblies to monitor and manage temperatures within packaged electronics. From mission critical enclosures to medical equipment, and from mobile equipment to large rack and room assemblies, it has delivered solutions to the market for the past decade.

EVENT LISTING

Curb Soaring Operations Costs - Learn how at Remote 2008 Conference & Expo

The cost of energy is rising, changing the way individuals spend and how companies do business. Now more than ever providers and distributors of electric power, oil & gas, communications and water/wastewater services cannot afford to be cutting into budgets for field work, gas for crew vehicles, and maintaining/repairing out-of-date monitoring and networking systems.

Join us November 5th-6th in Atlanta, and learn ways to curb operations costs for your company.

The Remote 2008 Conference and Expo is a great investment in your operations concerning green and sustainable future, and also a unique learning and networking experience. With more than 55 speakers covering over 50 educational sessions, highly targeted exhibitors featuring the latest technology, and pre-conference workshops from the ISA, it is a must-attend event!

“With the expansion of our show program to include topics such as cyber and physical security, remote smart services, and power protection technology, as well as our always popular remote monitoring and networking tracks, Remote 2008 is poised to help everyone in the industry,” said Nick Depperschmidt, program chairman, Remote 2008. “With the expansion of wireless technology, added focus on secure sites and communications, the evolution of monitoring devices and a movement towards increased revenue through service oriented products, the remote market is set to move from worries of an aging infrastructure and work force, to the next generation of remote site and equipment management.”

Click here to visit the Remote Expo Web site: http://www.remotemagazine.com/rem08_index.php.

JOB LISTING
Upcoming Industry Events - Click here to view full Calendar
November
2-6 IMAPS 2008, Rhode Island, N.Y.
3-7 InfraMation 2008, Reno, Nev.
13 Packaging Developments and Innovations: From System Design to Integrated Delivery, San Jose, Calif.
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