March 2009

Watlow Releases New Circulation Heater
Watlow, a designer and manufacturer of electric heaters, controllers and temperature sensors, has released the CAST-X 3000 circulation heater, a heater that offers high flow volume at the required temperature through a single compact product. Typical applications include steam generation and superheating for process applications and applications where cleanliness is a major concern. These include heating volatile materials in cases where contamination could be a problem such as deionized (DI) water and in food and beverage applications. The CAST-X 3000 is also available with optional explosion proof enclosure for use in hazardous environments.

The heater has two helical coiled tubes and tubular elements cast into a robust aluminum body that serves as the heat transfer media between the tubular element and the process tubes. It features heavy wall 316L seamless process tubing.

The CAST-X 3000 features a fluid path independent of the heater sheath preventing fluid contamination, an integrated thermostat housing allowing the heater to run dry and the dual tube construction allowing water flow rates to 20 GPM when run in parallel. Its non-welded construction minimizes potential leakage, allows high-pressure operation and is self-draining when mounted vertically.

Reflow Compatible Low Noise Laser Diode Driver for RoHS Compliance SMT Features OEM Package Upgrade
Wavelength Electronics has released its low noise FL500 Laser Diode Driver was recently re-engineered to integrate with higher temperature RoHS-compliant manufacturing processes. It is now compatible with reflow processing less than 250°C.

This surface mount chip is well suited for OEM instrumentation. It offers low noise laser diode control that can be configured either as two independent 250 mA drivers or a single 500 mA driver. The FL500 can run on a 3 V Lithium-ion battery or up to a 12 V power supply. Small size, low noise and modest power requirements make it the choice for handheld precision laser instrumentation.

E Instruments Releases New Hot-Wire Thermo-Anemometer
The VT100 is a compact, rugged hot-wire thermo-anemometer well suited for use in laboratories, clean rooms, air balancing and other applications. The backlit LCD display is easy to read in either light or dark environments.

The VT100 includes air velocity of 0 to 6,000 FPM, 0.01 resolution. Air flow has optional cones. The thermo-anemometer also features an ice blue 128 by 128 pixel display. The dimensions are 5 inches by 2.5 inches by 1.25 inches and a 9 V battery is included.

Flared Pin Fin Heat Sinks are Alternative for Natural Convection
Cool Innovations, Inc. has released a new line of extremely powerful flared pin fin heat sinks. The heat sinks provide unparalleled cooling power because of a unique structure that was specifically optimized for natural convection environments.

The new heat sinks feature a rugged array of round pins and are suitable for harsh industrial environments and outdoor applications. Flared pin fin heat sinks feature an array of round pins that are slanted outward. The sparsely configured staggered pin array and the flared structure combine to produce a cooling power in natural convection. At the same time, the omni-directional pin configuration ensures that the heat sinks operate efficiently in any orientation. Flared pin fins offer up to a 30-percent performance premium over traditional pin fin heat sinks and a substantially larger cooling premium over the majority of other heat sink designs.

Flared pin fin heat sinks are forged from highly thermally conductive aluminum alloys. They are available in a wide variety of square, rectangular and round configurations, ranging in footprint from 1 inch by 1 inch to 5 inches by 5 inches and in height from 0.7 inch to 2 inches. The new heat sinks are well suited for emerging green technologies such as solar cells and advanced LED lighting, as well as any other applications and devices operating in natural convection environments.

CPI Opens RD&T Center with Thermal and Product Test Labs
Chatsworth Products, Inc. (CPI), a manufacturer of systems designed to organize, store and secure IT infrastructure equipment has opened a new Research Development and Training (RD&T) Center that allows visitors to learn about and interact with CPI Products and Solutions, while offering them the ability to observe data center thermal testing, as well as in-house product testing.

The Thermal Test Lab allows CPI to model real-world data center issues, demonstrate the efficiencies of CPI Passive Cooling Solutions and discuss with customers how to effectively design their data center for optimum thermal management. The Product Test Lab presents the technology and equipment required for precise mechanical testing, electrical testing and prototyping of CPI Products.

 The Training Center, which features complete audio visual capabilities, offers a fully equipped location for effectively training customers and CPI employees. Arranged in classroom-style, the Training Center seats up to 125 visitors and can be separated using room dividers, creating multiple smaller training rooms for more intimate sessions.
CPI’s Product Showroom gives customers the ability to interact with multiple products, all functioning together in one environment. Currently CPI cabinets, racks, cable management, cable tray, wall-mount enclosures and remote monitoring and power management products are installed in the RD&T Center’s Product Showroom.
With a comfortable high-tech space, the Customer Meeting Center includes complete audio visual capabilities, seating for up to 25 visitors and a full-service catering area. In addition, electronic privacy glass windows are located on either side of the room, allowing the Thermal Test Lab and Product Showroom to be viewed at anytime from within the Customer Meeting Center.

DuPont Wafer Level Packaging Solutions, Nippon Kayaku and MicroChem Sign Joint Development Agreement
DuPont Wafer Level Packaging (WLP) Solutions, part of DuPont Electronic Technologies, and Nippon Kayaku Co. Ltd. (NKC), together with NKC’s wholly owned subsidiary, MicroChem Corp. have signed a Joint Development Agreement to develop new advanced photodefinable epoxy-based materials directed toward emerging WLP and 3D/Through-Silicon Via (TSV) applications. DuPont WLP Solutions and MicroChem have developed a first-generation photodielectric adhesive dry film material that will soon be commercialized as DuPont PerMX 3000. With new advanced epoxy resins from Nippon Kayaku, supplier of epoxy resins for microelectronic applications, the companies expect to accelerate product development and introduce a series of new materials over the next five years.

DuPont estimates the materials market for wafer level packaging, 3D and TSV to grow from about $100 million in 2009, to more than $600 million in 2013 and could as much as double to $1.2 billion by 2015.

Fraunhofer Institute Berlin Selects Asymtek’s Dispensing and Coating Technology to Equip its Research Center
Asymtek, a Nordson company focused on dispensing, conformal coating and jetting technologies, and the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) Berlin have entered a collaborative effort to support microelectronics packaging and encapsulation research using Asymtek’s advanced dispensing and coating technology.

Fraunhofer IZM recently installed Asymtek’s Axiom X-1020 high volume dispensing system in its Center for Applied Research, which focuses on interconnection technologies and microelectronics. The Axiom system, equipped with the DispenseJet DJ-9000 valve, is being used for underfilling inter-chip gaps, wafer level underfilling for Chip-on-Wafer assemblies, and glob top jetting over wire bonds.

Thermacore to Develop Active Heat Sink Technology
Thermacore, Inc. has been awarded a $9.5 million contract, if all options are exercised, by the Defense Advanced Research Projects Agency (DARPA) for the development of micro-technologies for air-cooled exchangers (MACE).

The successful development of this technology will significantly improve the thermal performance of military electronic systems such as telecommunications, active sensing and imaging, radar and other platforms. The goal of the MACE program is the development and demonstration of micro-technologies that will enable thermal performance improvements and reduce electrical consumption of air-cooled heat exchangers. The MACE program is a two-phase effort designed to run 48 months through the fourth quarter of 2013.

To support this development effort, Thermacore assembled a team of academic and industrial partners, which will each bring their technology and platform experience to bear on the proposed solution. Thermacore will coordinate these efforts and attempt to move these technologies into an "applied product" to support the current and future needs of the US Military. Thermacore's partners in this effort include the University of Minnesota, Lockheed Martin Company and The Bergquist Torrington Company.

Thermal Management of Outdoor Enclosures/Shelters for All Applications Webinar
March 25 at 10-11 a.m. Mountain Standard Time

This webinar will provide an understanding of the issues involved in the thermal management of outdoor systems including solar loads. Attendees will learn techniques in the design, specification and management of outdoor shelters, enclosures, boxes and pedestals that will be effective for the dissipation of heat generated by electronic systems and external conditions. Particular attention will be paid to the calculation, importance and mitigation of solar loads.

Read more about this webinar!

March
3/30- April 3 Embedded Systems Conference, San Jose, Calif.
31- April 2 IPC APEX Expo 2009, Las Vegas, Nev.

April
1-3 CTIA Wireless, Las Vegas, Nev.
17-23 NAB, Las Vegas, Nev.
20-23 SAE World Congress, Detroit, Mich.

ECS Meeting
May 24-29
San Francisco, Calif.

Founded in 1902, ECS has become the leading society for solid-state and electrochemical science and technology. ECS has 8,000 scientists, engineers and students in over 75 countries worldwide that hold individual membership, as well as over 90 corporations and laboratories who hold corporate membership.

ECS is engaged in a broad range of solid-state and electrochemical topics broken into technical interest areas, of which the Dielectric and Semiconductor Materials, Devices, and Processing category is one of our largest and most active segments.

SEMICON West 2009
July 14 - 16
San Francisco, CA

Extreme Electronics brings leaders of cutting-edge technologies, like solid-state lighting, to SEMICON West 2009, July 14-16, Moscone Center, San Francisco, CA

Register Now!

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