eNewsletter

April 2009

In This Issue:

Featured Article

  • Thermal Property Mapping at the Micro and Nanoscale

Product News

  • Electronic Interconnect Technology Offers PCB Thermal Management Materials, Constructions
  • Induction Heating System for Nanoparticle Research
  • REOTEMP Weld Pad/Tube Skin Thermocouples & RTD’s
  • Simultaneous Lead and Lead-free Convection Soldering from Rehm Thermal Systems
  • Longwatch adds Thermal Imaging to Video Surveillance Software

Industry News

  • Thermal Management and Technology Symposium Sessions Announced
  • Nuventix Secures $8 Million in New Funding
  • CoolIT Systems Closes $6.2 Million Financing

Event Listing

  • Description and Application of Electronics Cooling Equipment

Thermal News Magazine

  • Download the Latest Issue!

 

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FEATURED ARTICLE  
Thermal Property Mapping at the Micro and Nanoscale
Thermal management is a pressing issue for micro and nanoscale devices and materials and is considered by many experts to be one of the greatest challenges for future generation CMOS devices. Thermal management is also a key element in energy efficient laser and light emitting diodes where excess heat reduces efficiency. Read Entire Article
PRODUCT NEWS

Electronic Interconnect Technology Offers PCB Thermal Management Materials, Constructions
Electronic InterconnectElectronic Interconnect Technology (EI) now offers a wide range of printed circuit board materials, constructions and configurations for electronic assemblies requiring heat management characteristics (high-power devices, RF and wireless and lighting/LED boards). EI has been UL certified for metal-clad PCBs with a standard dielectric, and can work with various thicknesses of aluminum and copper metal cores, offering precise machining tolerances and high-quality fabrication services for effective thermal management and long-term board reliability.

Other constructions include 2-layer T-lam, hybrid IMPCBs with FR-4/T-preg, multilayer metal base construction, and multilayer FR-4/T-preg hybrids.


Induction Heating System for Nanoparticle Research
AmbrellAmbrell has released a nanoparticle hyperthermia research featuring the EASYHEAT line of induction heating systems in the 1 kW to 10 kW power range. This induction heating system is used in thermal therapy research to generate alternating magnetic fields to elevate and manage the temperature of a solution of nanoparticles in vitro or (in animal studies) in vivo.

The system includes an EASYHEAT power supply with a frequency range of 150 kHz to 400 kHz, a three-coil set, a fiber-optic temperature sensor with optional controller, a serial data-link cable to your PC and plastic and glass vials starter kit with insulating paper. This system can achieve field strength of up to125 kA/m.

An RF-immune temperature transducer provides temperature indication and closed-loop control of your process. The convenient table-top design is portable and suitable for clean medical environments.


REOTEMP Weld Pad/Tube Skin Thermocouples & RTD’s
REOTEMPREOTEMP manufactures a full line of standard and custom weld pad thermocouples and RTD’s. The weld-pad (tube skin) termination allows a temperature sensor to be welded directly onto piping or other metal surfaces to sense the surface temperature. Weld pads are most commonly used in fired heater tubes, refinery heater tubes, boilers and furnaces in refineries and industrial boilers. However, they can be used in virtually any application requiring surface temperature measurement.

Choose from a variety of junction styles (knife-edge shaped, V shaped, wedge shaped, etc.), materials, wrap-around angles, expansion loops, stem lengths, and spring loaded covers. REOTEMP’s weld pads allow severe service temperature measurement with minimum drift and minimum radiant heat impingement.  The addition of a REOTEMP shield will improve the efficiency and accuracy of your weld pad.


Simultaneous Lead and Lead-free Convection Soldering from Rehm Thermal Systems
Rehm Thermal Systems has released its Dual Lane Vision X series convection soldering system. Enabling simultaneous lead-rich and lead-free reflow soldering in a single system, the technology is well suited for manufacturers looking to run parallel processes conveniently and cost-effectively.

The Dual Lane Vision X series is equipped with two conveyor lanes which can be operated asynchronously at different speeds. Employing this unique multi-track variant, manufacturers can also operate the two lanes asymmetrically with different lane widths. The two conveyors can be loaded with diverse PCBs printed with different solder pastes, while a flexible heating system enables the selection of ideal reflow profiles for the separate products. Rehm’s Vision X ovens utilize homogenous, non-separated heating and cooling zones across the entire width of the conveyor, increasing operating convenience and reducing investment cost compared to other dual process design offerings.

Based on the Vision series convection reflow soldering equipment, the Dual Lane Vision X series is a future-proofing system providing reliable, repeatable soldering results. Available with either an air or nitrogen atmosphere, the Vision Series offers an integrated residue management system including the company’s Rehm Pyrolysis technology in the heat zones. Virtually maintenance-free, Pyrolysis splits long molecular chains into shorter ones to reduce the amount of condensable waste and unwanted dripping within the process chamber. The result is efficient and environmentally friendly disposal of contamination and increased user productivity. 


Longwatch adds Thermal Imaging to Video Surveillance Software
The Longwatch Video Surveillance System now has an interface to FLIR’s A-Series Thermal Imaging cameras, so that thermal images can be viewed on standard HMI/SCADA software, such as Wonderware InTouch or GE Fanuc iFix. This capability expands process monitoring, maintenance and process diagnostics, because the thermal images allow operators to see product/utility leaks, “hot spots” in a process, imperfections in finished goods and other anomalies. Infrared imaging can also be used for intrusion monitoring.

Thermal imaging has been used to analyze processes and for security purposes for years, but such systems typically have been specialized, stand-alone or handheld systems.  Now, Longwatch enables real-time thermal images to be displayed on HMI screens in the control room, integrated with process displays, so operators can see what is happening in a process or on an assembly line. Thermal images can be displayed side by side with video images on the same screen, for a complete picture of the process.

The FLIR thermal cameras connect to Longwatch Video Engine software, installed at strategic sites in the plant, next to process equipment and along automation assembly lines. The video engine continuously records images from multiple thermal and standard video cameras onto a local disk for up to 30 days and sends “video clips” over the plant network to the Longwatch Video Control Center (VCC) in the plant’s control room. The VCC then sends the clips to HMI/SCADA software, a cellphone or PDA, and stores them in a Video Historian. Clips can be sent on a regular scheduled basis, on command from the HMI/SCADA system, when a process or assembly step occurs, or in real time when an alarm occurs. The Longwatch system also enables cameras to be located in far remote regions, communicating back to the central control room over a variety of low-speed or high-speed networks.

The thermal camera and the Longwatch software at the remote site can be configured to alarm when pre-defined temperature conditions are detected, such as if a steam leak occurs or a process becomes too hot or too cold, or if an unexpected image appears, such as an intruder. The system can retrieve thermal images from before the incident occurs, such as 30 seconds before the alarm, and immediately send a video clip to the operator when the alarm occurs. Longwatch creates a “video sequence of events recorder.”  The operator can switch to a live video feed and monitor the process from the control room.

If more data is needed for a detailed analysis of the problem, all or part of the Longwatch system’s video history can be retrieved from the Longwatch Video Engine in high-resolution format, downloaded to a thumb drive or DVR, and viewed on a PC.

The Video Historian enables users to acquire and store video clips linked with process and manufacturing variables such as time of day, camera number, batch step, machine ID and other control system tags. This gives users the ability to store hourly, daily or weekly thermographs of process components to benchmark patterns and changes over time. It also allows thermal video clips to be stored for each step of a process, to document that steps were completed successfully or for quality control purposes.

The Video Historian allows multiple images to be displayed at the same time, so engineers can compare processes side by side. Process managers may find problems they did not know even existed and would not have found in the past without thermal imaging.

Having the ability to see imperfections in a process is not the only benefit.  Thermal imaging also allows users to see unnecessary usage of equipment, warning signs that equipment is on the way out, and gives managers plenty of warning of pending problems, allowing them to make informed decisions on how to proceed in certain situations.

INDUSTRY NEWS

Thermal Management and Technology Symposium Sessions Announced
The 2009 preliminary program for Thermal Management and Technology Symposium 2009 is well underway. New sessions have recently been added, as well as a pre-conference workshop scheduled for October 19th.

The two-day symposium, being held October 20th and 21st in Denver, Colo., will feature leading presentations on the latest advancements in thermal technology for product design, system development and process management.

Design engineers, system engineers, process engineers, material scientists and R&D managers will have the opportunity to learn about the most recent thermal management technologies, and also network with peers and potential business partners.

Conference Sessions
Advanced Ceramic Thermal Control Options
PC Smith - Oasis Materials Corp.

Smarter Solutions for Heat Treatment
Peter Sherwin - EUROTHERM

Heat Pipe Assisted Spreader Plates
Scott Garner and Jens Weyant - Advanced Cooling Technologies, Inc.

Carbon Aluminum Composites – High Efficiency Thermal Management Materials
Nan Jiang - Applied Nanotech, Inc.

Advanced Cooling Solutions for High Power Laser Diodes & IGBTs
Madhav Datta, Mark McMaster and Fred Rebarber - Cooligy, Inc.

Automating Semiconductor Package Thermal Characterization and Design
Sarang Shidore - Mentor Graphics – Mechanical Analysis Division

Defense and High-End Commercial OEM Electronics
Matt Tracewell - Tracewell Systems

To learn more and to view session descriptions, please visit: www.thermalnews.com/conf_09/TN09_program.php.

Pre-Conference Workshop
“Thermal Management of Electronic/Telecommunications Systems and Components”
Maurice J. Marongiu is the owner and founder of MJM Engineering Co.
This one-day workshop that will help attendees gain an understanding of the issues involved in the thermal management of electronic and telecommunication systems.

To learn more about the workshop, please visit: http://www.thermalnews.com/conf_09/TN09_workshops.php


Nuventix Secures $8 Million in New Funding
Nuventix, Inc., innovator of SynJet active thermal management solutions, has closed $8 million in new funding. The funding will accelerate advanced development of the company’s SynJet cooling technology, an active cooler of solid state lighting which uses synthetic jets to enable energy efficiency and reduce energy consumption in lighting designs. Funding will also be used to add support resources for existing and new Asian distributors as Nuventix expands its geographic reach.

Braemar Energy Ventures contributed $3 million and Uniquest of Korea added $1 million. The funding is an extension of Nuventix’s series C round of fundraising announced in July 2008 in which Braemar Energy Ventures had already participated. This additional $4 million closes out the company’s total $18 million series C round. The company also signed an agreement with Silicon Valley Bank that makes a $4 million line of credit available to the company. Nuventix has now raised $32.5 million since its inception. Nuventix will use these funds to add specialized engineering staff and to facilitate expansion into new geographies.


CoolIT Systems Closes $6.2 Million Financing
CoolIT Systems, a company focused on advanced electronics cooling solutions, has completed a CDN $6.2 million financing package. The investment was led by iNovia Capital, a leading venture capital fund manager, and included existing angel investors and AVAC Ltd.

CoolIT recently launched its Domino Advanced Liquid Cooling (ALC) solution for desktop computers to the industry. This financing was timed to support that launch and accelerate the completion of a number of development projects for OEMs based on patented CoolIT technology.

EVENT LISTING

Description and Application of Electronics Cooling Equipment
April 30 at 10-11 a.m. Mountain Standard Time
This webinar will provide a working knowledge of the cooling equipment used in the thermal management of electronic and telecommunication systems. This course is designed to help engineers and technicians with some thermal background (but new to the electronics, telecommunications field) understand how these devices can assist in the thermal challenges and demands of the electronics fields.
Read more about this webinar!

THERMAL NEWS MAGAZINE  
Spring Cover

Download the PDF version today!

This issue includes articles on the following topics:

  • Thermal Management of LED Systems
  • Synthetic Jets: Solution for Active Cooling
  • Embedded CFD Helps Reduce Number of Thermal Prototypes from Up to 12 to One
  • EBM-Pabst and DSM Engineering Plastics Collaboration Leads to Innovative Fan in LED Headlamps for Hella
JOB LISTING
logo
Upcoming Industry Events - Click here to view full Calendar

April
20-23 SAE World Congress, Detroit, Mich.

May
3-7 LightFair, New York, N.Y.
7-8 Thermal Solutions & Motor Solutions Conference, Colulmbus, Ohio
12-15 National Manufacturing Week, Melbourne, Australia
17-22 Networld/Interop, Las Vegas, Nev.
24-29 2009 Electrochemical Society Annual Spring Meeting, San Francisco, Calif.
31-6/5 Cleo/IQEC 09, Baltimore, Md.
31-6/5 SID Display Week, San Antonio, Tx.


Indium LogoThermal Interface Materials Technical Symposium
May 20, 2009
Huntsville, AL

FREE TECHNICAL SYMPOSIUM on THERMAL INTERFACE MATERIALS
May 20th, 2009

Detailed technical information on the basic properties of metal thermal interface materials (TIMs) from leading authorities.

Topics:

  • Metal thermal interface materials and options
  • Physical attributes of solder and TIMs, from compressible metals to liquid metals
  • Issues associated with thermal management
  • Thermal resistivity of various TIMs
  • Reliability test data of TIMs:
    • Humidity
    • Drop test
    • Bake test

Real world data, hands-on activities, industry experts.

LOCATION:
Holiday Inn Huntsville-Research Park
5903 University Drive
Huntsville, AL 35806

AGENDA:
7:30 Complimentary breakfast
8:00AM – 11:00AM  Symposium
11:00 open discussions
 Presenters are US citizens.        

COST:
 Free

REGISTER:
Seating is limited. Register by May 13th  at www.indium.com
Questions:  Jeannine Morris (jmorris@indium.com or 315-853-4900 ext. 7576)

Presented by: The Indium Corporation
Sponsored by: Thermal News.


logoECS Meeting
May 24-29
San Francisco, Calif.

Founded in 1902, ECS has become the leading society for solid-state and electrochemical science and technology. ECS has 8,000 scientists, engineers and students in over 75 countries worldwide that hold individual membership, as well as over 90 corporations and laboratories who hold corporate membership.

ECS is engaged in a broad range of solid-state and electrochemical topics broken into technical interest areas, of which the Dielectric and Semiconductor Materials, Devices, and Processing category is one of our largest and most active segments.


logoSEMICON West 2009
July 14 - 16
San Francisco, CA

Extreme Electronics brings leaders of cutting-edge technologies, like solid-state lighting, to SEMICON West 2009, July 14-16, Moscone Center, San Francisco, CA

Register Now!

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