July 2009

Lord Corp. Develops Thermally Conductive No Pump-Out Grease
Lord Corp., a supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry, has released a new thermally conductive grease that does not pump out.
 
Lord TC-501 Grease was developed to be a no pump-out material to replace greases used as thermal interface materials (TIM) between the heat spreader and the heat sink. TC-501 Grease, a silicone TIM, provides high thermal conductivity and low thermal resistance for applications that require superior heat dissipation. Unlike commercially available greases that eventually pump out, Lord TC-501 grease was developed using proprietary technology that prevents pump-out.

According to Sara Paisner, Staff Scientist for Microelectronics Technology at Lord Corporation, “TC-501 Grease is a great example of an innovative technology solving complex fundamental problems for the next generation of thermal management. This material allows for the use of thermal greases in applications previously restricted due to the risk of pump-out.”

Created in response to a need expressed by Lord customers for a thermally conductive grease that does not pump out, TC-501 Grease can be used in a variety of applications.

Galil Motion Control Announces Thermocouple and RTD Interface for RIO Pocket PLC
Galil Motion Control, developer of the RIO Pocket PLC series for intelligent and cost-effective I/O handling, now offers the new SCB-48x06 signal conditioning board that allows the RIO to interface with thermocouples and RTDs (Resistive Temperature Device). The SCB-48206 interfaces to 6 RTDs and the SCB-48306 interfaces to 6 thermocouples.

“Galil’s RIO Pocket PLC and new SCB interface for RTDs and thermocouples provide an easy method for precisely handling temperature control applications,” said Lisa Wade, Vice President of Sales and Marketing at Galil Motion Control.

The SCB-48x06 connects directly to the 26-pin d-sub connector of the RIO-47120 and is oriented vertically from the RIO connector. Other mounting options are available on request. The RIO provides an intelligent, low-cost and compact solution for handling I/O. Each RIO unit contains 16 analog I/O and 32 digital I/O. Multiple RIO units can be networked together for unlimited I/O expansion. The RIO has a fast, 32-bit processor and non-volatile memory for storing programs.

Features include arithmetic and logical processing, data logging, process control loops, counters and timers. The RIO allows communication via both Ethernet and RS232. It also supports Modbus TCP/IP as master and slave, a Web interface and the ability to send email alerts. It can easily interface with HMIs, PLCs, motion controllers and other I/O devices. The RIO is simple to program with Galil’s intuitive two-letter commands or Ladder Interface Software.

Pfannenberg Inc. Releases Two New DTS 3000 Series Product Models
Pfannenberg, a worldwide leader in thermal management, has introduced two new additions to the industry-leading DTS 3000 Series side-mount cooling units for industrial electrical enclosures. The new DTS 31x5 and DTS 32x5 cooling units enhance the DTS 3000 Series with 5-7,000 and 9-12,000 Btu/h ranges. The two new designs are offered in NEMA Type 12, NEMA Type 3R/4 and stainless steel NEMA Type 4/4X designs, with operating voltages of 115 VAC, 230 VAC or 460 VAC for a total of 18 new models.

Pfannenberg's new design combines fit, form and function. With balanced and bold aesthetics, the new DTS 3000 Series cooling units also provide practical and energy efficient features to assist engineers in solving the most demanding applications. The 12-inch depth of the DTS 31x5 can be installed standard into 12-inch deep NEMA enclosures, while long internal airflow paths maximizes cooling performance and energy efficiency while providing years of trouble-free field operation.

The indoor NEMA Type 12 units can be used for a variety of industries including material handling, textile, glass, automation and assembly. The outdoor NEMA Type 3R/4 cooling units can be used in applications such as telecom, renewable energy (solar and wind) and outdoor electronic applications such as electronic billboards and kiosks. The stainless steel NEMA Type 4/4X version is well suited for all wash-down related applications including food and beverage, pulp and paper, waste water management, packaging and marine applications.

Ideal Thermal Imager Helps Keep Server Rooms Up and Running
Ideal Industries, Inc. a company focused on test and measurement technology, has released its new HeatSeeker Thermal Imager, a low-cost, high performance camera that blends visible images with infra-red images to track down problems that threaten the continuous operation of  server rooms and data centers.

Nextreme Raises $8 million in Corporate Funding
Nextreme Thermal Solutions, a company focused on microscale thermal and power management products for the electronics industry, has raised $8 million in additional Series B financing from undisclosed corporate investors. Nextreme has now raised more than $21 million in Series B financing and $35 million since its inception in 2004. The additional funding will be used to expand Nextreme’s presence and products for energy harvesting for micro and portable power along with solidifying its position for thermal management products in computing, consumer and mobile markets.

Nextreme offers microscale cooling and thermal energy harvesting solutions that integrate directly into electronic and consumer product packaging. Nextreme’s scalable cooling and power generation solutions have the potential to have a major impact on mainstream industries such as automotive, computing, consumer, mobile, and telecommunications. Applications for the technology include: CPU/GPU hot spot cooling, power MOSFET cooling, LED cooling, laser diode cooling, thermal energy scavenging, thermal control in consumer products, power harvesting for sensors, and process control.

American Standard Circuits, Inc Receives Second Technology Patent
American Standard Circuits, Inc. (ASC) reported it has received its second technology patent from the United States Patent & Trademark Office. U.S. Patent 7,540,081 covers Thermasil Film which is used to bond high or low frequency printed circuit boards (PCB) to a metal heat sink with a thermally conducting electrically insulating silicone based film.

Thermasil can be made to any thickness from 3 mil to 25 mil and thermal conductivity can be tailored from 1.5 to 4.5 W/mK. ASC will license this technology to companies and fabricators interested in using this technology.

The Middleby Corp. Completes Acquisition of CookTek LLC
The Middleby Corp. has acquired CookTek LLC (“CookTek”), a company focused on the manufacture of induction cooking and warming systems for the commercial foodservice industry with approximately $10 million in annual sales. The purchase price for the acquisition was $9 million, which was financed under Middleby’s senior revolving credit facility. Further payments are due to the seller under an earnout arrangement to the extent certain financial performance targets are achieved. The addition of CookTek’s induction line of cooking and warming systems complements Middleby’s existing portfolio of innovative technologies.

Thermal Management & Technology Symposium 2009
October 20-21
Denver, CO

Thermal Management and Technology Symposium 2009 is a conference highlighting the latest advancements in thermal technology for product design, system development and process management, will be held October 20-21 in Denver, Colorado.

This event will feature presentations on thermal manufacturing technology, materials and R &D. Topics will include new thermal technology as well as the latest market trends affecting the industry. The conference is designed for design engineers, system engineers, process engineers, material scientists and R&D managers with organizations in a variety of industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

Download the THERMAL News spring issue PDF version today!

This issue includes articles on the following topics:

• Thermal Management of LED Systems
• Synthetic Jets: Solution for Active Cooling
• Embedded CFD Helps Reduce Number of Thermal Prototypes from Up to 12 to One
• EBM-Pabst and DSM Engineering Plastics Collaboration Leads to Innovative Fan in LED Headlamps for Hella

July
13-17 SemiconWest 2009, San Francisco, Calif.
7/19-23 ASME Thermal Engineering, San Francisco, Calif.

August
29-Sept. 2 30th International Thermal Conductivity Conference and the 18th
International Thermal Expansion Symposium, Pittsburgh, Penn.

SMTA International 2009
Technical Conference: October 4-8 / Exhibition: October 6-7
Town and Country Resort and Convention Center
San Diego, CA

Come. Focus. SMTA International 2009
Don't miss the industry's strongest technical program.  Attendees at SMTAI 2009 can look forward to 120 papers, 18 short courses, Harsh Environment Electronics Symposium, Emerging Technologies, Lead-Free Symposium, Contract Manufacturing Symposium, and a special keynote speaker from Jet Propulsion Labs. 

SMTAI attracts the perfect blend of users, suppliers, academics, and technologists, making it the absolute location to learn and do business.  Early Bird rates still available to exhibit.  Get your booth before they are all gone!

Visit the Web site to learn more: http://smta.org/smtai/index.cfm

AVS International Symposium and Exhibition
11/8 -11/13
San Jose, CA

The AVS 56th International Symposium and Exhibition, November 8-13, 2009, in San Jose, California will feature technical sessions and an exhibition with scientific instrumentation, components, accessories, tools and services. This program includes applications and products in fields such as surface analysis and engineering; biomaterials; MEMS/NEMS; nanotechnology; plasma science; thin film; vacuum technology; and electronic materials and processing. Exhibit attendance is free. For more information, visit www.avs.org.

Informex USA 2010
February 16-19
San Francisco, Calif.

Since it's inception in 1983, Informex has built the leading North American event for the chemical industry. Focusing on the business of fine and custom chemistry, Informex is bringing together serious buyers and sellers of chemicals, chemical technologies, and related services.

The best networking. The best events. The best business can be found at Informex 2010.

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