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Low Profile Heat Sinks Cool Hot Components in Constricted Packages
Advanced Thermal Solutions, Inc. has introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks feature a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm.

The heat sinks are fabricated from extruded aluminum which minimizes thermal resistance from the base to the fins and minimizes weight. Tests on maxiFLOW heat sinks using an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks.

Low profile maxiFLOW heat sinks are provided pre-assembled with ATS maxiGRIP mounting hardware. This attachment system includes a plastic frame clip that snaps securely around the component. A stainless steel spring clip runs through the fin field and fastens to the frame. The result is steady, even mounting pressure with no holes in the PCB. These assemblies meet Telcordia GR-63-Core; ETSI 300 019; and MIL-STD-810 shock and vibration testing standards. A thermally conductive, phase-change interface pad maximizes the heat transfer from component to the cooling solution.

Pricing for ATS low profile maxiFLOW heat sinks starts at less than $10.00 each, which includes the mounting hardware and phase change thermal interface material. The heat sinks are also available without the mounting system.

ECD Announces New Calibration Plan to Reduce Costs and Downtime
An integral part of what makes even the most sophisticated equipment effective is not its design, its software, or even its age; it is its calibration.  Over the last year ECD not only pointed out the need to make sure ovens remain accurate throughout production and thermal profiles remain consistent through every run, they also developed products to assure that they do.  In keeping with that spirit of defining and ensuring good thermal quality management, they are also offering an easy and cost-effective method to make sure those profiling tools are always in calibration.

ECD asked its thermal profiling customers what would improve their ability to always have their thermal profilers in calibration.  The answers were consistent, and direct.  They want to be reminded when to recalibrate.  They want it done faster.  They want it done cheaper.  And they want a loaner to keep them running while it’s being done. 

The company developed its M.O.L.E. Calibration Contracts With Options.  Available for most ECD thermal profilers, the calibration contracts are designed with the process engineer in mind.  They are structured to increase productivity by saving time, money and eliminating downtime during calibration.

Available in three levels, Basic, Express and Premium, the contracts range from one to three years in length.  Some of the features available are pre-pay discounts, pre-paid quick-turn shipping and no-charge repair of incidental issues up to either $100 or $200, depending on the plan.  With the Premium Plan, a “loaner” is also included so that downtime is not just minimized, it is eliminated. 

Infrared Thermometer with Patented Circle/Dot Laser Sighting and Wireless USB Model OS-DT8855W 
The high performance, handheld OS-DT8855W infrared thermometer is a non-contact temperature measurement instrument that features a laser circle/dot sight. The patented laser sighting system defines the target for point and shoot measurement of temperatures from -50°C to 1,370°C and reads surface temperature in less than a second. Comes complete with hard carrying case, mini-tripod, power supply, one type K thermocouple, USB wireless data receiver, PC software and probe lead adaptors.

AcuTemp Thermal Systems and CSafe, LLC to Offer Temperature Controlled Containers to Aid in Relief Efforts in Haiti
AcuTemp Thermal Systems, a manufacturer of active and passive containers for transporting temperature sensitive pharmaceutical and bio-medical products; and CSafe, LLC, a provider of active container solutions for the temperature sensitive airfreight market, are offering relief agencies their temperature controlled containers for use in shipping and storing blood, vaccines and other critical temperature sensitive medical supplies for the Haitian relief effort.

"We are deeply saddened by the tragic earthquake in Haiti," stated Brian Kohr, president of AcuTemp Thermal Systems. "Because of the desperate need, we are offering our solutions to relief agencies that are administering medical aid to the victims. We know the importance of keeping life-saving blood, medicines and other medical supplies at the right temperature to ensure they are usable, so offering our products for this cause is the best way for us to help the victims of this disaster that are suffering so greatly."

Products available to relief agencies from AcuTemp include passive insulated shipping boxes and active mobile containers, such as the company's AX56L mobile refrigerator/freezer and the AX2100LG refrigerated pallet sized container, which are powered by either AC or battery.

CSafe, LLC, provider of the AcuTemp RKN refrigerated air cargo container, is making their state-of-the-art battery or AC-powered refrigerated unit available to relief agencies and their transport partners. The unit is ideal for transporting or storing large quantities of temperature-controlled medical supplies that are critical in the life-saving rescue effort.

Thermal Remediation Services, Inc. Renamed TRS Group, Inc.
Thermal Remediation Services, Inc.  has changed its corporate name to TRS Group, Inc. (TRS Group). The name change recognizes corporate expansions to deliver its core technology, Electrical Resistance Heating (ERH), into both the global environmental market and the thermally enhanced oil recovery market.

For the last 10 years, TRS has been the market leader and premier provider of ERH in the US environmental market. TRS Group is taking this success globally to address the cleanup of thousands of contaminated sites in both developed and developing countries.

The oil sands of Alberta Canada contain bitumen reserves similar in size to the oil fields in Saudi Arabia. TRS Group is now poised to apply ERH for the heat enhanced recovery of bitumen from known reservoirs where current extraction techniques are not viable due to geology, cost or environmental impact.

There is a limited number of speaking slots in each track, so it is imperative that you submit your abstract before the deadline on March 12, 2010.

Thermal Management and Technology Symposium 2010 provides an excellent forum to discuss new developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements today and in the future. Attendees will include design engineers, system engineers, process engineers, material scientists and engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

Full-conference registration fees will be waived for all confirmed speakers.

For more information on submitting an abstract please visit www.thermalnews.com.

January
24-29 Photonics West, San Jose, Calif.
26-28 AHR Expo, Chicago, Ill.

February
9-12 MDM West, Anaheim, Calif.
15-19 APEC, Washington, D.C.
19 Semiconductor Packaging – Impacting the Age of Consumer Electronics, San Jose, Calif.
24-25 Data Center World, London

2010 IPC APEX EXPO
April 6-8
Las Vegas, Nev.

There’s No Other Show Like It in the World!
2010 IPC APEX EXPO™ — the world’s premier technical conference & exhibition for board design and manufacture, electronics assembly and test held in exciting Las Vegas!

More than 120 technical conference papers and professional development workshops designed to keep you on top of emerging technologies and industry research.

More than 80 standards development committee meetings make it possible for you to participate in the development of the standards that influence all aspects of printed boards and electronics assembly and manufacturing. Top industry suppliers showcasing the latest equipment, chemicals, materials, software and services. Join your colleagues and an international audience of more than 10,000 for education, valuable networking, and critical industry standards development.

Learn more at www.IPCAPEXEXPO.org

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