February 2010

Thermoelectric Cooling for Industrial Enclosures
The utilization of thermoelectric technology to cool industrial enclosures can provide a number of significant advantages for certain applications when compared to “conventional” cooling methods like vapor-compression refrigeration and water-cooled systems such as air conditioners and air-to-water heat exchangers. Using an electrical current passed through semiconductors to facilitate temperature change, thermoelectric coolers eliminate the need for refrigerants and operate with fewer moving parts—cooling enclosures to temperatures below or near ambient conditions while producing far less noise and vibration than conventional cooling methods.

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Orion Fans Delivers New Line of Fan Accessories
Orion Fans now offers a line of fan accessories. The accessories include steel wire and wire mesh finger guards, filter kits and plastic guards, fan cords and daisy chains, and three conductor and custom AC power cords.

All of Orion’s fan accessories are UL/cUL approved and are designed for use in industrial control, telecommunication, computer equipment and electronic enclosure and panel applications.
Orion’s comprehensive line of cord, guard and filter fan accessories include six product lines. Steel wire and mesh guards are available for fan sizes from 25 mm to 254 mm, and feature steel wire electroplated in nickel chrome. Plastic guards are available in sizes ranging from 40 mm to 172 mm and feature PBT, UL94V-0 thermoplastics.

Filter kits contain an ABS UL94V-0 fan guard, as well as retainer and media in 30 ppi or 45 ppi. Orion Push-on guards do not require any hardware and are available for 60 mm, 80 mm, 92 mm, 120 mm and 172 mm fans. The fan cord and daisy chain accessories are available in 2, 3, 4, 6 and 9 head daisy chain versions with lead lengths ranging from 12 inches to 12 feet, with or without 1-15 AC plug.

Triton Introduces High Thermal Conductivity Carbon Composites
Triton has introduced its Cryo-Carbon, a new carbon-carbon (C-C) composite material with increased thermal conductivity for extreme heat dissipation applications. Cryo-Carbon is comprised of 70 percent graphite flake, which provides two-dimensional conductivity in excess of 550 W/mK. Unlike pitch-based fiber composites which only provide conductivity in the axial direction of the filament, conductive flake offers two-dimensional conductivity, providing increased thermal performance throughout the composite X-Y plane.

Combined with a high thermally conductive graphitic matrix, a C-C composite that outperforms fiber-based 2D materials in thermal performance is produced. Additionally, Cryo-Carbon composites can be molded into continuous complex shapes with conductive paths oriented X-Y, X-Z or Y-Z. The composites are robust and can be machined to accommodate interface tolerances for heat sinks and other heat dissipative devices.

Rapid-pulse NtelliJet Provides New Spot Cooling Technology
JaroThermal has introduced its new NtelliJet series of low-profile coolers. The low-acoustic cooler uses rapid-fire pulses of turbulent air, produced by an oscillating diaphragm working between 50 and 200 hz, to cool heat sinks and surrounding components.

The features of the NtelliJet cooler present an entirely new concept of thermal cooling ability. In addition to reliability and low profile height, max 15 mm, there is also a total elimination of mechanical wear, dirt and dust clogging. The series is also immune to shock and vibration, and provides 100,000 hours of life at 60°C. The NtellJet is well suited for focused thermal requirements, when cooling is needed for specific chips or areas of coverage.

Low Profile Heat Sinks Cool Hot Components in Constricted Packages
Advanced Thermal Solutions, Inc. has introduced a line of lower height maxiFLOW heat sinks for cooling ICs and other hot components in narrow packaging and low airflow velocity conditions. The maxiFLOW heat sinks features a spread fin array that maximizes surface area for more effective convection (air) cooling. Standard sink heights are as low as 9.5 mm.

The heat sinks are fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins and minimizes weight. Tests on maxiFLOW heat sinks using an airflow rate of just 100 lfm show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using other heat sinks. 

maxiFLOW heat sinks are provided pre-assembled with ATS maxiGRIP mounting hardware. This attachment system includes a plastic frame clip that snaps securely around the component. A stainless steel spring clip runs through the fin field and fastens to the frame. The result is steady, even mounting pressure with no holes in the PCB. These assemblies meet Telcordia GR-63-Core, ETSI 300 019 and MIL-STD-810 shock and vibration testing standards. A thermally conductive, phase-change interface pad maximizes the heat transfer from component to the cooling solution.

Are the Days of an American Market for Axial Fans Numbered?
The Americas market for axial fans was estimated be worth $239.2 million in 2009, having decreased 23.9 percent since 2008. Whilst majority of this $75 million decrease was attributed to the global economic conditions, sustained outsourcing of production in recent years, has led many to worry that that this is not just the affects of a struggling global economy, but further evidence of sustained decline.

Over the last 10 years, electronics designers have outsourced production facilities, and sub-contracted product assembly to increase price competitiveness and focus exclusively on product design and development. This has relocated the market base for constituent components offshore, to the detriment of local component suppliers. The result has been that many American suppliers now view business opportunities within America as limited only to securing ‘design’ contracts.

Outsourcing assembly is prevalent mainly in the consumer electronics sectors, such as computers, and audio visual equipment. Whilst these constitute two of the largest markets for axial fans, specifically DC product types, they collectively accounted for little over a quarter of the Americas market in 2009. This means that in 2009, over $170 million dollars was attributed to applications currently perceived to be stable, including medical devices, telecommunication infrastructure and industrial automation machinery.

“The AC and DC axial fans market was actually experiencing positive single digit growth before the downturn in 2009, albeit substantially less than the markets in EMEA or Asia Pacific,” said Senior Analyst Rob Carter. “This is reflective of a stable market that is simply losing global share, rather than declining. For this reason growth is expected to return to this market in the latter half of 2010, and over the next four years market growth of over $65 million is expected.”

IQS Testing Purchased by the Compliance Management Group
Degree Controls, Inc. (DegreeC) has sold its IQS Testing business unit to The Compliance Management Group (CMG). CMG is a testing and engineering services company with an extensive customer base. The addition of IQS with its additional capabilities staff will make the combined service offerings very attractive to customers who are looking for that one stop solution. 

“As a result of this acquisition, clients will have expanded capabilities and services at their disposal, said Eric Wilbur, president, CMG. “CMG has made its mark providing EMC and reliability testing in industries like ITE, automotive, defense, aerospace and Test & Measurement. The addition of the IQS labs brings NEBS, thermal management, air flow testing and product safety testing into the fold making the CMG team a more effective choice.”

Caliente Earns ISO Certification in Quality Management Systems
Caliente LLC has earned International Organization for Standardization (ISO) Certification 9001:2008 in quality management systems. The company, which specializes in engineered thermal systems including heater pads, PTC blower heaters, thermoelectric coolers and heat pipe heat exchangers as well as specialty printed circuits, began the ISO effort in February 2009 with the goal of instilling better disciplines and communications within Caliente.

There is a limited number of speaking slots in each track, so it is imperative that you submit your abstract before the deadline on March 12, 2010.

Thermal Management and Technology Symposium 2010 provides an excellent forum to discuss new developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements today and in the future. Attendees will include design engineers, system engineers, process engineers, material scientists and engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

Full-conference registration fees will be waived for all confirmed speakers.

For more information on submitting an abstract please visit www.thermalnews.com.

February
21-25 APEC, Palm Springs, Calif.
23-24 Data Centre World, London
25 From Chip to System: Design Challenges and Solutions, San Jose, Calif.
28-March 5 PittCon, Orlando, Fla.

March
23-25 CTIA Wireless, Las Vegas, Nev.

April
6- 9 IPC APEX Expo 2009, Las Vegas, Nev.
10-15 NAB, Las Vegas, Nev.
13-15 SAE World Congress, Detroit, Mich.
26-29 Embedded Systems Conference, San Jose, Calif., San Jose, Calif.

2010 IPC APEX EXPO
April 6-8
Las Vegas, Nev.

There’s No Other Show Like It in the World!
2010 IPC APEX EXPO™ — the world’s premier technical conference & exhibition for board design and manufacture, electronics assembly and test held in exciting Las Vegas!

More than 120 technical conference papers and professional development workshops designed to keep you on top of emerging technologies and industry research.

More than 80 standards development committee meetings make it possible for you to participate in the development of the standards that influence all aspects of printed boards and electronics assembly and manufacturing. Top industry suppliers showcasing the latest equipment, chemicals, materials, software and services. Join your colleagues and an international audience of more than 10,000 for education, valuable networking, and critical industry standards development.

Learn more at www.IPCAPEXEXPO.org

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